|
Layer | 1-36 layer |
Min Board Thickness | 4 layer 0.40mm 16mil |
6 layer 1.00mm 40mil | |
8 layer 1.20mm 48mil | |
10 layer 1.60mm 60mil | |
Min space | 0.075mm 3mil |
Min line width | 0.075mm 3mil |
Min hole size | 0.1mm 4mil |
Plated wall thickness | 0.025mm 1mil |
Plated hole dia tolerance | ±0.10mm 4mil |
NO Plated hole dia tolerance | ±0.05mm 2mil |
Outline tolerance | ±0.15mm 6mil |
Twist and bent | ≤1.5% |
Board thickness tolerance | ±10% |
Copper weight | 0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz |
Surface finish | HASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc. |
Board material | FR-4 glass epoxy, FR4 High Tg, RoHS |
compliant; Aluminum, Rogers, etc. | |
Solder Mask | Double-sided green LPI,Also support Red,White,Yellow,Blue,Black |
Silk Screen | Double-sided or single-sided in white,yellow,black,or negative |
Insulation resistance | 1012Ω (Normal) |
Through hole resistance | <300Ω(Normal) |
Electric strength | >1.3KV/mm |
Current strength | 10A |
Peel strength | 1.5N/mm |
Thermal stress | 288℃20 Seconds |
Flammability | 94V-0 |
Test voltage | 50-300V |
Quantity | Prototype&Low Volume PCB Assembly |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size |
BGA and VFBGA | |
Leadless Chip Carriers/CSP | |
Double-sided SMT Assembly | |
Fine Pitch to 0.8mils | |
BGA Repair and Reball | |
Part Removal and Replacement | |
File Formate | Bill of Materials |
Gerber files | |
Pick-N-Place file | |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
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6 Layer Led Printed Circuit Board FR4 500MM Length*60MM Width black soldermask Images |