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Shenzhen Yingstar Electronics Co., Ltd.
Yingstar Electronics Co., Ltd.
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Clock LED PCB Assembly Small Pcb Rigid Flex Pcb Manufacter 2-30 Layers

Clock LED PCB Assembly Small Pcb Rigid Flex Pcb Manufacter 2-30 Layers

Brand Name : YINGSTAR
Model Number : YSPA074
Certification : UL/CE/ROHS
Place of Origin : China
MOQ : 5pcs
Price : Negotiation
Payment Terms : T/T, Western Union
Supply Ability : 100,000pcs per month
Delivery Time : 15-20working days
Packaging Details : Anti-static bag + Anti-static bubble wrap + Carton box
Layer : 6
Color : green
Material : FR4
Surface finish : immersion gold
Thickness : 1.6mm
Copper weight : 2 OZ
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clock small pcb Rigid Flex Pcb Manufacter 2-30 Layers LED PCB Assembly

1. Technical requirements for pcb&pcb assembly:


  • Professional Surface-mounting and Through-hole soldering Technology
  • Various sizes like 1206,0805,0603,0402,0201 components SMT technology
  • ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
  • PCB Assembly With UL,CE,Rohs Approval
  • Nitrogen gas reflow soldering technology for SMT.
  • High Standard SMT&Solder Assembly Line
  • High density interconnected board placement technology capacity.

2. Our PCBA Capabilities


Type of AssemblySMT,Thru-hole
Solder TypeWater Soluble Solder Paste,Leaded and Lead-Free
ComponentsPassive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement
Bare Board SizeSmallest:0.25*0.25 inches
Largest:20*20 inches
File FormateBill of Materials
Gerber files
Pick-N-Place file
Types of ServiceTurn-key,partial turn-key or consignment
Component packagingCut Tape,Tube,Reels,Loose Parts
TestingFlying Probe Test,X-ray Inspection AOI Test
PCB assembly processDrilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing

3. Our PCB Technical Specification


Layer1-36 layer
Max Board Size1100*599mm 43.3" * 24"
Min Board Thickness4 layer 0.40mm 16mil
6 layer 1.00mm 40mil
8 layer 1.20mm 48mil
10 layer 1.60mm 60mil
Min space0.075mm 3mil
Min line width0.075mm 3mil
Min hole size0.1mm 4mil
Plated wall thickness0.025mm 1mil
Plated hole dia tolerance±0.10mm 4mil
NO Plated hole dia tolerance±0.05mm 2mil
Outline tolerance±0.15mm 6mil
Twist and bent≤1.5%
Board thickness tolerance±10%
Copper weight0.5oz, 1.0 oz, 1.5oz, 2.0oz,3.0 oz,4.0 oz
Surface finishHASL,Nickle, Imm Gold,Imm Tin,Imm Silver, OSP etc.
Board materialFR-4 glass epoxy, FR4 High Tg, RoHS
compliant; Aluminum, Rogers, etc.
Insulation resistance1012Ω (Normal)
Through hole resistance<300Ω(Normal)
Electric strength>1.3KV/mm
Current strength10A
Peel strength1.5N/mm
Thermal stress288℃20 Seconds
Flammability94V-0
Test voltage24-300V


Product Tags:

led pcb assembly manufacturers

      

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